Technical Details

• Package / Case 236-LFBGA
• Mounting Type Surface Mount
• Speed 2000MIPS
• RAM Size 512K x 8
• Operating Temperature 0°C ~ 70°C (TA)
• Oscillator Type External
• Program Memory Type ROMless
• Core Processor XCore
• Core Size 32-Bit 16-Core
• Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V
• Connectivity RGMII, USB
• Supplier Device Package 236-FBGA (10x10)
• Number of I/O 73
• DigiKey Programmable Not Verified
• California Prop 65 California Prop 65 Information
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant