技术参数

• Package / Case 169-BBGA
• Mounting Type Surface Mount
• Interface SPI, SSP, UART
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TA)
• Non-Volatile Memory ROM (1kB)
• On-Chip RAM 84kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 400MHz
• Supplier Device Package 169-PBGA (19x19)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)