技术参数

• Package / Case 260-BBGA
• Mounting Type Surface Mount
• Interface PCI, SPI, SSP, UART, USB
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TA)
• Non-Volatile Memory External
• On-Chip RAM 308kB
• Voltage - I/O 3.30V
• Voltage - Core 1.50V
• Clock Rate 300MHz
• Supplier Device Package 260-PBGA (19x19)
• ECCN 3A001A3
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)