技术参数

• Package / Case 196-BGA, CSPBGA
• Mounting Type Surface Mount
• Interface SPI, SSP
• Type Fixed Point
• Operating Temperature -40°C ~ 125°C (TA)
• Non-Volatile Memory External
• On-Chip RAM 128kB
• Voltage - I/O 3.30V
• Voltage - Core 2.50V
• Clock Rate 150MHz
• Supplier Device Package 196-MBGA (15x15)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)