技术参数

• Package / Case 256-BGA
• Mounting Type Surface Mount
• Interface EBI/EMI, HPI, I2C, McASP, SPI
• Type Floating Point
• Operating Temperature -55°C ~ 125°C (TC)
• Non-Volatile Memory ROM (384kB)
• On-Chip RAM 288kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 250MHz
• Supplier Device Package 256-BGA (17x17)
• ECCN 3A001A2C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant