技术参数

• Package / Case 338-LFBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (16kB)
• On-Chip RAM 56kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.35V
• Clock Rate 432MHz
• Supplier Device Package 338-BGA (13x13)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant