技术参数

• Package / Case 153-TFBGA
• Mounting Type Surface Mount
• Memory Size 640Gbit
• Memory Type Non-Volatile
• Operating Temperature -40°C ~ 105°C
• Voltage - Supply 2.7V ~ 3.6V
• Technology FLASH - NAND (TLC)
• Clock Frequency 200 MHz
• Memory Format FLASH
• Supplier Device Package 153-BGA (11.5x13)
• Memory Interface eMMC
• Memory Organization 80G x 8
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant