技术参数

• Package / Case 8-SOIC (0.154", 3.90mm Width)
• Delay Time 1.4ns
• Number of Channels 1
• Mounting Type Surface Mount
• Output LVDS
• Type Buffer, ReDriver
• Input CML, LVDS, LVPECL
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 3V ~ 3.6V
• Applications BLVDS
• Current - Supply 50mA
• Data Rate (Max) 400Mbps
• Supplier Device Package 8-SOIC
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant