技术参数

• Package / Case 272-LFBGA
• Mounting Type Surface Mount
• Speed 100MHz, 250MHz
• Program Memory Size 4.063MB (4.063M x 8)
• RAM Size 768K x 8
• Operating Temperature -40°C ~ 125°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• EEPROM Size 256K x 8
• Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7
• Data Converters A/D 72x12b SAR
• Core Size 32-Bit Tri-Core
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
• Connectivity CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART
• Peripherals Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
• Supplier Device Package 272-BGA (16x16)
• Number of I/O 207
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant