技术参数

• Package / Case 1369-BFBGA, FCBGA
• Speed 600MHz, 1.3GHz
• RAM Size 256KB
• Number of I/O 478
• Operating Temperature -40°C ~ 110°C (TJ)
• Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Primary Attributes Versal™ AI Core FPGA, 800k Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DDR, DMA, PCIe
• Supplier Device Package 1369-FCBGA (35x35)
• Architecture MPU, FPGA
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• RoHS Status ROHS3 Compliant