技术参数

• Package / Case 88-VFQFN Exposed Pad, CSP
• Mounting Type Surface Mount
• Interface EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART
• Type Floating Point
• Operating Temperature -40°C ~ 125°C (TJ)
• Non-Volatile Memory External
• On-Chip RAM 384kB
• Voltage - I/O 3.30V
• Voltage - Core 1.10V
• Clock Rate 300MHz
• Supplier Device Package 88-LFCSP-VQ (12x12)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant