技术参数

• Package / Case 4-XFDFN Exposed Pad
• Output Type Push-Pull
• Mounting Type Surface Mount
• Number of Elements 1
• Logic Type Buffer, Non-Inverting
• Operating Temperature -40°C ~ 125°C (TA)
• Voltage - Supply 1.1V ~ 3.6V
• Number of Bits per Element 1
• Current - Output High, Low 4mA, 4mA
• Supplier Device Package 5-X2SON (0.80x0.80)
• ECCN EAR99
• HTSUS 8542.39.0001