技术参数

• Package / Case 24-XFBGA, WLBGA
• Mounting Type Surface Mount
• Type Data Acquisition System (DAS)
• Data Interface I2C, SPI
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 3.1V ~ 5.5V, 3.1V ~ 5.5V
• Resolution (Bits) 20 b
• Voltage Supply Source Single Supply
• Supplier Device Package 24-WLP (2.78x1.71)
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant