• In Stock 1619

Technical Details

  • Package / Case 225-LFBGA
  • Mounting Type Surface Mount
  • Speed 300MHz, 400MHz
  • Operating Temperature -40°C ~ 125°C (TJ)
  • Core Processor ARM® Cortex®-R52
  • Voltage - I/O 1.8V, 3.3V
  • Supplier Device Package 225-LFBGA (13x13)
  • Ethernet 10/100/1000Mbps (1)
  • USB USB 2.0 (1)
  • Number of Cores/Bus Width 1 Core, 32-Bit
  • Co-Processors/DSP Multimedia; NEON™ SIMD
  • Graphics Acceleration No
  • Security Features Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG
  • Additional Interfaces CANbus, I2C, SCI, SPI, WDT
  • HTSUS 8542.31.0001
  • Moisture Sensitivity Level (MSL) 3 (168 Hours)
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

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